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ENTITY physical_component SUBTYPE OF (assembly_component); END_ENTITY; -- physical_component |
Entity data types and their attributesproduct_definitionid: identifier; (OPT) description: text; formation: product_definition_formation; frame_of_reference: product_definition_context; (DER) name: label; product_definition_relationship id: identifier; name: label; (OPT) description: text; relating_product_definition: product_definition; related_product_definition: product_definition; component_definition (RT) (DER) related_product_definition: component_definition; property_definition name: label; (OPT) description: text; definition: characterized_definition; (DER) id: identifier; product_definition_shape - assembly_component (RT) (DER) definition: assembly_component; physical_component - |
| assembly_module_component (Assembly_module_with_subassembly_mim) |
| assembly_module_macro_component (Assembly_module_with_macro_component_mim) |
| bare_die_component (Assembly_module_design_mim) |
| cable_component (Assembly_module_with_cable_component_mim) |
| interconnect_module_component (Assembly_module_with_interconnect_component_mim) |
| interconnect_module_macro_component (Interconnect_module_with_macros_mim) |
| interface_component (Interface_component_mim) |
| packaged_component (Assembly_module_design_mim) |
| physical_shield (Discrete_shield_mim) |
| routed_interconnect_component (Assembly_module_design_mim) |
| routed_physical_component (Assembly_module_design_mim) |
| sequential_laminate_stackup_component (Sequential_laminate_assembly_design_mim) |
| amd_physical_component_subtypes (Assembly_module_design_mim) |
| ap210_apd_physical_component_subtypes (Ap210_electronic_assembly_interconnect_and_packaging_design_mim) |
Global rules for this entity data type- |